Product

NEMST-Jet2008I 系列

Back-Side Polymer Removal Plasma

Back-Side Polymer Removal Plasma
Back-Side Polymer Removal Plasma
  • Arc Jet Plasma design.
  • Integrated with Equipment Front End Module. (EFEM)
  • Vacuum Rotating Stage design to fix the wafer.
  • Excellent cleaning effect with concentrated plasma energy.
  • Fast treatment speed.
  • Gap between nozzle and wafer can be larger.
  • Indirect/Remote plasma design.
  • Reaction gas: CDA and etc.
  • Low reaction gas consumption and running cost.
  • Effective Range: Φ 10 mm or smaller.
  • Treatment Speed: 50 mm/sec~300 mm/sec.
  • Gap between nozzle and substrate: 5 mm ~ 15 mm.
  • Plasma On Stabilizing Time: < 0.5 sec.
  • High plasma stability.
  • Indirect/Remote Plasma with no ESD.
  • Can be suitable for different kinds of materials with various shapes.